Huawei moves AI chip launch to first quarter of 2027
Huawei Technologies announced in Shanghai on Thursday that it will release two new artificial intelligence chips in the first and third quarters of 2027.
Accelerated chip release schedule
The company previously planned to launch the Ascend 960DT training chip in the third quarter but has now shifted the date forward by nine months. A spokesperson stated that the new timeline allows the firm to double performance and advance capabilities year by year. The second chip, the Ascend 960PR for inference, will arrive in the third quarter of 2027, which is also a quarter earlier than expected.
New computing architecture details
Huawei introduced its UnifiedBus interconnect technology and Hi-ONE optical system to support these new processors. These components enable high-speed connections between up to 4,000 processors within a SuperPoD cluster. The firm has already shipped more than 1,000 such systems to over 370 customers.
Future product roadmap plans
David Wang Tao said the Ascend series will continue its annual upgrade cycle with future models launching in 2028 and 2029. The announcements occurred at the Huawei Connect 2026 conference ahead of high-level trade talks between US and Chinese leaders.
All 3 outlets report consistently
No differences in figures, names or dates across these reports.
- South China Morning Post
- Business Recorder
- TechCrunch
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