Huawei unveils new AI computing cluster and chips for 2027 launch
Huawei Technologies unveiled a new artificial intelligence computing cluster in Shanghai on Thursday.
New optical technology introduced
The firm introduced near-packaged optics to its SuperPoD architecture for the first time. This combination allows high-speed optical connections to reach up to 4,000 processors within a single system.
Chip launch schedule confirmed
Rotating chairman David Wang stated that two new chips will arrive in 2027. The 960DT model is scheduled for the first quarter while the Ascend 960PR follows in the third quarter.
Current customer reach grows
The company has already shipped more than 1,000 such systems to over 370 customers. UnifiedBus technology remains key to connecting large numbers of chips for future computing needs.
2 outlets, different leads
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South China Morning Post
Huawei unveils latest tech to boost AI power in push to break China’s Nvidia reliance
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Business Recorder
China's Huawei to launch two new AI chips in 2027
Reported by
2 independent outlets. Headlines as published. Links open the original report.