Samsung and Qualcomm develop organic bridge technology for AI chips
Samsung and Qualcomm are collaborating to create a new packaging method using organic materials for AI processors.
New packaging method uses resin
The companies have named this approach 2.1D packaging to distinguish it from current silicon-based methods. This technique replaces traditional materials like glass or ceramic with layers cut from resin or polymer. The goal is to lower production costs while improving bandwidth for microcircuit dies.
Technology adapts PCB manufacturing
The organic bridge element is a scaled-down version of technology already used in printed circuit board production. This adaptation allows mass producers to reduce expenses during the assembly phase of semiconductor fabrication. The process connects multiple dies without relying on inorganic alternatives typically found in 2.5D chips.
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