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Researchers test laser slicing on various lab-grown diamond types

A team at Chiba University in Japan published a study on November 1, 2026, regarding how ultrashort laser pulses cut different kinds of laboratory diamonds.

Ultrashort laser pulses can slice lab-grown diamond along useful crystal plane
File photo Ultrashort laser pulses can slice lab-grown diamond along useful crystal plane Photo: Phys.org

Laser method creates internal stress

Focused beams generate microscopic changes inside the crystal structure. These modifications cause internal stresses that guide where cracks travel through the material.

Study addresses knowledge gaps

Scientists previously lacked clear data on how diamonds made by different processes react to this treatment. The new paper investigates these specific responses to improve future manufacturing techniques.

Publication details and authors

Professor Hirofumi Hidai led the research group from the Graduate School of Engineering. Mahiro Ikeno also coauthored the work which appeared in Diamond and Related Materials.

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